Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints-Reference-Cited by-同舟云学术

Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints

Author:

Yao Zongxiang,Jiang Shan,Yin Limeng^ORCID,Ling Diying,Zhang Zhongwen,Zhang Liping

Funder

National Natural Science Foundation of China

Natural Science Foundation of Chongqing

National College Students Innovation and Entrepreneurship Training Program

Chongqing Technology Innovation and application demonstration project

the Program for Creative Research Groups in University of Chongqing

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

Reference21 articles.

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