Author:
Jang Guh-Yaw,Huang Chien-Sheng,Hsiao Li-Yin,Duh Jenq-Gong,Takahashi Hideyuki
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. J.H. Lau, Flip Chip Technologies (New York: McGraw-Hill, 1996), pp. 26–30.
2. D.S. Patterson, P. Eleniu, and J.A. Leal, Adv. Electron. Packaging 1, 337 (1997).
3. C.S. Chang, A. Oscilowski, and R.C. Bracken, IEEE Circuits Dev. Mag. 14, 45 (1998).
4. A.A. Liu, H.K. Kim, K.N. Tu, and P.A. Totta, J. Appl. Phys. 80, 2774 (1996).
5. H.K. Kim, K.N. Tu, and P.A. Totta, Appl. Phys. Lett. 68, 2204 (1996).
Cited by
28 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献