Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows-Reference-Cited by-同舟云学术

Root Cause Investigation of Lead-Free Solder Joint Interfacial Failures After Multiple Reflows

Published:2016-12-20 Issue:3 Volume:46 Page:1674-1682
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Li Yan^ORCID,Hatch Olen,Liu Pilin,Goyal Deepak

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-016-5211-0.pdf

Reference11 articles.

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3. D. Bušek, K. Dušek, M. Plaček1, J. Urbánek, J. Horník, and J. Holec, IEEE Conference Proceedings From the 38th International Spring Seminar on Electronics Technology (2015), p. 306.

4. S. Perng, W. Xie, T. Lee, and C. Guirguis, Conference Proceedings from SMTA International, (2015), 104.

5. Y. Li, M. Pacheco, D. Goyal, J.W. Elmer, H.D. Barth, and D. Parkinson, Conference Proceedings from the 64th Electronic Components and Technology Conference (ECTC) (2014), p. 1457.

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