Characterization and optimization of copper chemical mechanical planarization-Reference-Cited by-同舟云学术

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Characterization and optimization of copper chemical mechanical planarization

Published:2002-10 Issue:10 Volume:31 Page:1059-1065
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Laursen Thomas,Grief Malcolm

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-002-0043-5.pdf

Reference3 articles.

1. ITRS Roadmap 2000, http://public.itrs.net/Files/2000UpdateFinal/2kUdFinal.htm.

2. Seeichi Kondo, Noriyuki Sakuma, Yoshio Homma, Yasushi Goto, Naofumi Ohashi, Hizuru Yamaguchi, and Nobuo Owada, Proc. IITC 2000, 253 (2000).

3. T. Laursen, S.R. Runnels, S. Basak, M. Grief, and K. Murella, RS Conf. Proc. ULSI XV, 677 (2000).

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of Evolution Processes of Wafer Profiles With Edge Over Erosion in Copper CMP;IEEE Transactions on Semiconductor Manufacturing;2017-02

2. Preparation of Composite Spherical Alumina Nanoparticles and Study on their CMP Performance;Key Engineering Materials;2013-07

3. Preparation of monodisperse polystyrene/silica core–shell nano-composite abrasive with controllable size and its chemical mechanical polishing performance on copper;Applied Surface Science;2011-11

4. The Important Role of Oxidant in Copper Interconnection Chemical Mechanical Polishing for GLSI;Materials Science Forum;2010-11

5. Agglomeration characteristic of particles in alumina slurry by addition of chemicals and milling process for Cu CMP;Materials Science and Engineering: B;2005-04

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