Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints-Reference-Cited by-同舟云学术

Effect of Interfacial Reaction on the Tensile Strength of Sn-3.5Ag/Ni-P and Sn-37Pb/Ni-P Solder Joints

Published:2006-12-29 Issue:1 Volume:36 Page:17-25
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chen Z.,He M.,Kumar A.,Qi G.J.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-006-0008-1.pdf

Reference33 articles.

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3. WEEE, Directive of The European Parliament and of the Council on Waste Electrical and Electronic Equipment, on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (Brussels: Commission of The European Communities, 2000), pp. 59–83

4. H.K. Kim, K.N. Tu, P.A. Totta, J. Appl. Phys. Lett. 68, 2204 (1996)

5. A.A. Liu, H.K. Kim, K.N. Tu, J. Appl. Phys. 80, 2774 (1996)

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