The Comprehensive Effect of Electronic Irradiation and Thermal Cycling on the Thermal and Mechanical Properties of Sn-3.0Ag-0.5Cu Solder Joints-Reference-Cited by-同舟云学术

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The Comprehensive Effect of Electronic Irradiation and Thermal Cycling on the Thermal and Mechanical Properties of Sn-3.0Ag-0.5Cu Solder Joints

Published:2024-07-09 Issue:9 Volume:53 Page:5534-5545
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Wu Chencheng,Liu Yang^ORCID,Xue Yuxiong,Zhao Xuewei,Li Nannan,Zhu Zhengqiang,Xing Chaoyang

Funder

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s11664-024-11294-4.pdf

Reference17 articles.

1. P. Kahn, T. Imken, J. Elliott, B. Sherwood, A. Frick, D. Sheldon, and J. Lunine, Environmental Design Implications for Two Deep Space SmallSats. Acta Astronaut. 139, 390 (2017).

2. K.L. Bedingfield, R.D. Leach, Spacecraft system failures and anomalies attributed to the natural space environment, in AIAA 1995 Space programs and Technologies Conference, 95-3564, pp. 1–2 (1995).

3. Z. Zhang, X. Hu, X. Jiang, and Y. Li, Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints. Metall. Mater. Trans. A 50, 480 (2019).

4. Q. Guan, C. Hang, S. Li, X. Tang, G. Yao, D. Yu, Y. Ding, X. Wang, and W. Zhang, Effect of Gamma Irradiation on Microstructural Evolution and Mechanical Properties of SnPb Eutectic Solder Joints. J. Mark. Res. 27, 2929 (2023).

5. Q. Guan, C. Hang, G. Yao, S. Li, D. Yu, Y. Ding, and Y. Tian, Effect of Gamma Irradiation on Microstructural Evolution and Mechanical Properties of Sn3Ag0.5Cu Solder Joints. J. Mater. Res. Technol. 24, 6022 (2023).

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