1. I. Shohji, T. Yoshida, T. Takahashi, S. Hioki, Mater. Sci. Eng. A 366, 50 (2004).
2. Y. Tomita, M. Tago, Y. Nemoto, and K. Takahashi, Electronic Mater. Pack., EMAP 2001 (19–22 November 2001), p. 107.
3. P.H. Lawyer, D. Choudhury, M.D. Wetzel, and D.B. Rensch, Electro. Manuf. Tech. Sym. 23rd IEEE/CPMT (19–21 October 1998), p. 390.
4. B.C. Kim, J.H. Kim, J.H. Lee, C.D. Yoo and D.S. Choi, J. Kor. Weld. Soc. 22, 258 (2004).
5. S.Y. Kang, P.M. Williams and Y.C. Lee, IEEE Trans. CPT 18, 728 (1995).