Hermetic Sealant Material Possibilities for IR Sensor Packaging-Reference-Cited by-同舟云学术

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Hermetic Sealant Material Possibilities for IR Sensor Packaging

Published:2019-07-19 Issue:10 Volume:48 Page:6470-6479
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Chidambaram Vivek,Bu Lin,Chuan Kai Liang

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-019-07427-9.pdf

Reference24 articles.

1. L. Mauri, E. Rizzi, M. Moraja, and M. Campaneillo, in EMPC Conference Proceedings (2013), pp. 1–4.

2. D. Xu, E. Jing, B. Xiong, and Y. Wang, IEEE Trans. Adv. Packag. 33, 4 (2010).

3. Y. Chen and P. Li, in ICRMS Conference Proceedings (2011), pp. 482–485.

4. M. Boutchich, K. Ziouche, M.A.-H. Yala, and D. Leclercq, Sensor Actuator A Phys 121, 1 (2005).

5. V. Chidambaram, X. Ling, and C. Bangtao, J. Electron. Mater. 42, 3 (2013).

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