Experimental Evaluation of Mixed Mode Stress Intensity Factor for Prediction of Crack Growth by Phoelastic Method

Author:

Singh Vinay Kumar,Gope Prakash Chandra

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Safety, Risk, Reliability and Quality,General Materials Science

Reference19 articles.

1. Post, D.: Photoelastic stress analysis for an edge crack in a tensile field. Proc. SESA 12(1), 99–116 (1954)

2. Wells, A.A., Post, D.: The dynamic stress distribution surrounding a running crack—a photoelastic analysis. Proc. SESA 16(1), 69–92 (1954)

3. Irwin, G.R.: Discussion on photoelastic stress analysis for an edge crack in a tensile field. Proc. SESA 16(1), 93–96 (1958)

4. Bradley, W.B., Kobayashi, A.S.: An investigation of propagating cracks by dynamic photoelasticity. Exp. Mech. 10(3), 106–114 (1970)

5. Schroedl, M.A., Smith, C.W.: Local stress near deep surface flaws under cylindrical bonding fields, progress in flaw growth and fracture toughness testing. ASTM STP 536 ATM, pp 45–63 (1973)

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