1. P. S. Burggraaf, “Wafer Cleaning: Brush and High-Pressure Scrubbers,” Semiconductor International, 4(7), 71 (1981).
2. T. H attori, “Contamination-Control Engineering in Wafer Processing: Problems and Prospects,” Technical Proceedings SIMCON/Japan 1989, pp. 244–255.
3. W. Kern, “The Evolution of Silicon Wafer Cleaning Technology,” J. Electrochem. Soc., 137(6), 1887 (1990).
4. V. Ramakrishna and J. Harrigan, “Defect Learning Requirements,” Solid State Technology, (1), 103–105 (1989).
5. A. J. Muller, L. A. Psota-Kelty, J. D. Sinclair, and P. W. Morrisson, “Concentrations of Organic Vapors and their Surface Arrival Rates at Surrogate Wafers During Processing in Clean Rooms,” Proceedings of the First International Symposium of Cleaning Technology in Semiconductor Device Manufacturing, Vol. 90-9, J. Ryzyllo and R. E. Novak, Eds., pp. 204–211, The Electrochem. Soc., Inc., New Jersey (1989).