1. Bair HE, Ludwick AG (1984) Use of model compounds to study the curing behavior of novolac epoxies. In: Proceedings of the 13th NATAS conference, NATAS preprints, vol 5, pp 224–228
2. Blyler LL, Bair HE, Hubbauer P, Matsuoka S, Pearson DS, Poelzing GW, Progelhof RC, Thierfelder WG (1986) A new approach to capillary viscometry of thermoset transfer molding compounds. Polym Eng Sci 26:1399–1404
3. Bair HE (1985) Curing behavior of an epoxy above and below Tg. ACS Polym Prepr 26(1):10–11
4. Hale A, Macosko CW, Bair HE (1991) Glass transition temperature as a function of conversion in thermosetting polymers. Macromolecules 24:2610–2621
5. Bair HE, Boyle DJ, Ryan JT, Taylor CR, Tighe SC, Crouthamel DL (1990) Thermomechanical properties of IC molding compounds. Polym Eng Sci 30:609–617