1. ASET (2013) Presentation slide dream-chip project by ASET (final result). March 8,
http://aset.la.coocan.jp/english/e-kenkyu/Dream_Chip_Pj_Final-Results_ASET.pdf
. Accessed 12 Jul 2014
2. Kada M (2014) R & D overview of 3D integration technology using TSV worldwide and in Japan. 2014 ECS and SMEQ joint international meeting (October 5–10)
3. Kohara S et al (2012) Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration. Presented at 3D system integration conference (3DIC), 31 January–02 February 2012) Osaka, Japan
4. Kohara S et al (2012) Thermal cycle tests and observation of fine-pitch IMC bonding in 3D chip stack. Presented at microjoining and assembly technology in electronics (MATE) conference, (31 January–1 February 2012), Yokohama, Japan (in Japanese)
5. Yoo JH et al (2010) Analysis of electromigration for cu pillar bump in flip chip package. Presented at electronics packaging technology conference (EPTC), (08–10 December 2010) Singapore