Publisher
Springer International Publishing
Cited by
29 articles.
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1. Review of Die-Attach Materials for SiC High-Temperature Packaging;IEEE Transactions on Power Electronics;2024-10
2. Degradation in Electrothermal Characteristics and Failure Mechanism of SiC JBS With Different Die Attach Materials Under 300 ∘C Power Cycle Stress;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08
3. Reliability and Failure Mechanisms of Direct Bonded Power Semiconductor Devices in Power Cycling Test;2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD);2024-06-02
4. Sintering Process Simulation of Ag Nanoparticles by Phase Field Method;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
5. Investigation of Two-Stage Ag-Sintering Processes for the Die Attach of Power Devices;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05