1. Nvidia—Drive PX Xavier … Pegasus.
https://www.nvidia.de/self-driving-cars/drive-px/
2. Bret, C.L.: Power electronics for EV/HEV—market, innovations and trends, Yole Development report (2016)
3. Michel, B.: Roadmap towards efficiency—zero-emission datacenters; IBM-Research, Advanced Thermal Packaging/Micro Integration 02 June 2015.
https://www.zurich.ibm.com/st/energy_efficiency/zeroemission.html
4. Brunschwiler, T., Paredes, S., Drechsler, U., Michel, B., Cesar, W., Leblebici, Y., Wunderle, B., Reichl, H.: Heat-removal performance scaling of interlayer cooled chip stacks. In: Proceedings of 12th Itherm Conference, Las Vegas, USA, 2–5 June 2010
5. Madhour, Y., Zervas, M., Schlottig, G., Brunschwiler, T., Leblebici, Y., Thome, J.R., Michel, B.: Integration of intra chip stack fluidic cooling using thin-layer solder bonding. In: Proceedings on 3DIC Conference, San Francisco, CA, USA, 2–4 October 2013