Publisher
Springer International Publishing
Reference20 articles.
1. W.R. Mann et al. The leading edge of production wafer probe test technology, in Proceedings of International Test Conference, 2004, pp. 1168–1195
2. S. Sayil, D.V. Kerns, S.E. Kerns, Comparison of contactless measurement and testing techniques to a new all-silicon optical test and characterization method. IEEE Trans. Instrum. Meas. 54(5), 2082–2089 (2005)
3. S. Sayil, “Optical Contactless Probing: An all-silicon, fully optical approach”- Special feature article. IEEE Des. Test Comput. 23(2), 138–146 (2006)
4. M. Sartori, Contactless testing using EB techniques: an important support to the debug of modern VLSI, in Proceedings of International IEEE Semiconductor Conference, CAS’95, 1995, pp. 545–555
5. F. Marc, H. Fremont, P. Jounet, M. Barre, Y. Danto, A general methodology using an electron beam tester applied to failure localization inside a logic IC. Microelectron. Eng. 26, 181–193 (1995)