Microstructure Engineering to Optimize Hardness and Conductivity in Electrolytic Tough Pitch Copper-Reference-Cited by-同舟云学术

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Microstructure Engineering to Optimize Hardness and Conductivity in Electrolytic Tough Pitch Copper

Published:2019-06-11 Issue:8 Volume:50 Page:3566-3577
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Harshavardhana N.,Gururajan M. P.,Pant Prita

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-019-05315-9.pdf

Reference41 articles.

1. Chapman: Copper Development Association Publication No. 122 and European Copper Institute Publication No. Cu0232, 1998.

2. J.R. Davis: ASM Speciality Handbook, ASM International, Materials Park, 2001.

3. C. Kittel, Introduction to Solid State Physics, Wiley, New York, 2004.

4. Y. Zhang, Y.S. Li, N.R. Tao, and K. Lu: Appl. Phys. Lett., 2007, vol. 91, pp. 10–3.

5. L. Lu, Y. Shen, X. Chen, L. Qian, and K. Lu: Science, 2004, vol. 304, pp. 422–6.

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low‐Temperature Annealing of Asymmetrically Cold‐Rolled Electrolytic Tough‐Pitch Copper: Anneal Hardening and Bimodal Microstructure;Advanced Engineering Materials;2024-05-20

2. A study on microstructure and recrystallization kinetics on low deformed pure ETP copper;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2022-05-31

3. A Comparative Study on Misorientations to Determine the Extent of Recrystallization in Pure ETP Copper;Physics of Metals and Metallography;2021-09-10

4. An investigation of stored energy in uniaxial and biaxial directional rolling on mechanical properties and microstructure of pure copper;Mechanics Based Design of Structures and Machines;2021-04-14

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