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Microstructure Engineering to Optimize Hardness and Conductivity in Electrolytic Tough Pitch Copper

  • Published:2019-06-11 Issue:8 Volume:50 Page:3566-3577
  • ISSN:1073-5623
  • Container-title:Metallurgical and Materials Transactions A
  • language:en
  • Short-container-title:Metall and Mat Trans A

Author:

Harshavardhana N.,Gururajan M. P.,Pant Prita

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Reference41 articles.

1. Chapman: Copper Development Association Publication No. 122 and European Copper Institute Publication No. Cu0232, 1998.

2. J.R. Davis: ASM Speciality Handbook, ASM International, Materials Park, 2001.

3. C. Kittel, Introduction to Solid State Physics, Wiley, New York, 2004.

4. Y. Zhang, Y.S. Li, N.R. Tao, and K. Lu: Appl. Phys. Lett., 2007, vol. 91, pp. 10–3.

5. L. Lu, Y. Shen, X. Chen, L. Qian, and K. Lu: Science, 2004, vol. 304, pp. 422–6.

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