An Open-Hardware Platform for MPSoC Thermal Modeling
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-030-27562-4_13
Reference21 articles.
1. Amrouch, H., Henkel, J.: Lucid infrared thermography of thermally-constrained processors. In: 2015 IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), pp. 347–352, July 2015. https://doi.org/10.1109/ISLPED.2015.7273538
2. Binkert, N., et al.: The gem5 simulator. SIGARCH Comput. Archit. News 39(2), 1–7 (2011). https://doi.org/10.1145/2024716.2024718
3. Choi, W., et al.: A compact resistor-based CMOS temperature sensor with an inaccuracy of 0.12 $$^{\circ }{C}$$ (3 $$\sigma $$ ) and a resolution FoM of 0.43 $${pJK^2}$$ in 65-nm CMOS. IEEE J. Solid-State Circ. 53, 3356–3367 (2018). https://doi.org/10.1109/JSSC.2018.2871622
4. Li, D., Tan, S.X., Tirumala, M.: Architecture-level thermal behavioral characterization for multi-core microprocessors. In: 2008 Asia and South Pacific Design Automation Conference, pp. 456–461, March 2008. https://doi.org/10.1109/ASPDAC.2008.4483994
5. Huang, W., Ghosh, S., Velusamy, S., Sankaranarayanan, K., Skadron, K., Stan, M.: HotSpot: a compact thermal modeling methodology for early-stage VLSI design. IEEE Trans. Very Large Scale Integr. (VLSI) Syst. 14(5), 501–513 (2006). https://doi.org/10.1109/TVLSI.2006.876103
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Modeling and Simulation Challenges and Solutions in Cooling Systems for Nanoscale Integrated Circuits [Feature];IEEE Circuits and Systems Magazine;2023
2. Towards EXtreme scale technologies and accelerators for euROhpc hw/Sw supercomputing applications for exascale: The TEXTAROSSA approach;Microprocessors and Microsystems;2022-11
3. The TEXTAROSSA Approach to Thermal Control of Future HPC Systems;Lecture Notes in Computer Science;2022
4. TEXTAROSSA: Towards EXtreme scale Technologies and Accelerators for euROhpc hw/Sw Supercomputing Applications for exascale;2021 24th Euromicro Conference on Digital System Design (DSD);2021-09
5. Dynamic Thermal Management in Many-Core Systems Leveraged by Abstract Modeling;2021 IEEE International Symposium on Circuits and Systems (ISCAS);2021-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3