Thermal Cycling Durability of Bonded PZT Transducers Used for the SHM of Reusable Launch Vehicles
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-07258-1_73
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1. Durability Assessment of Bonded Piezoelectric Wafer Active Sensors for Aircraft Health Monitoring Applications;Sensors;2024-01-11
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