1. R.R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein, Microelectronics Packaging Handbook, 2nd edn. (Springer, Dordrecht, 2012)
2. J. Prymark, S. Bhattacharya, K. Paik, R.R. Tummala, Fundamentals of Microsystems Packaging, 1st edn. (McGraw-Hill, New York, 2001)
3. J. Lu, C.P. Wong, IEEE Trans. Dielectr. Electr. Insul. 15, 1322 (2008)
4. Z. Dang, J. Yuan, J. Zha, T. Zhou, Progr. Mater. Sci. 57, 660 (2012)
5. S. George, M.T. Sebastian, Compos. Sci. Technol. 69, 1298 (2009)