Author:
Tai Tzu-Chun,Wu Hung-Wei,Wang Sin-Pei,Hung Cheng-Yuan,Tien Wei-Chen,Wang Yeong-Her
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference31 articles.
1. G.E. Ponchak, A. Margomenos, L.P.B. Katehi, Low-loss CPW on low-resistivity Si substrates with a micromachined polyimide interface layer for RFIC interconnects. IEEE Trans. Microw. Theory Tech. 49, 866–870 (2001)
2. L.L.W. Leung, W.C. Hon, K.J. Chen, Low-loss coplanar waveguides interconnects on low-resistivity silicon substrate. IEEE Trans. Compon. Packag. Technol. 27, 507–512 (2004)
3. V.V. Levenets, N.G. Tarr, T.J. Smy, J.W.M. Rogers, Characterization of silver CPWs for applications in silicon MMICs. IEEE Electron Device Lett. 26, 357–359 (2005)
4. R.R. Tummala, E.J. Rayaszewski, Microelectronic Packing Handbook (Van Nostrand Reinhold, New York, 1989)
5. J. Baliga, System-in-package uses silicon substrate. Semicond. Int. 27, 32 (2004)