Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints-Reference-Cited by-同舟云学术

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Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints

Published:2008-03-24 Issue:2 Volume:20 Page:186-192
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Li Guangdong,Shi Yaowu,Hao Hu,Xia Zhidong,Lei Yongping,Guo Fu,Li Xiaoyan

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-008-9696-z.pdf

Reference19 articles.

1. F.L. Zhu, H.H. Zhang, R.F. Guan et al., J. Mater. Sci: Mater. Electron. 17, 379–384 (2006)

2. B.P. Richard, G.L. Levoguer, K. Nimmo, An Analysis of the Current Status of Lead-Free Soldering (Department of Trade and Industry, UK, 1999)

3. M. Abtew, G. Selvaduray, J.Mater. Sci. Eng. R 27, 95–141 (2000)

4. D.R. Frear, Electron. Inf. Technol. 118, 81–86 (2001)

5. B. Salam, N.N. Ekere, D. Rajkumar, Proc 51st Electron. Comp. Technol. Conf. (IEEE Inc, Orlando, 2001) pp. 471–477

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