1. F.Y. Hung et al., Recrystallization and fracture characteristics of thin copper wire. J. Mater. Sci. 42, 5476–5483 (2007)
2. H. Clauberg, et al., Wire bonding with Pd-coated copper. In IEEE Components, Packaging and Manufacturing Technology Symposium, Japan, 2010, pp. 1–4
3. L.J. Tang, et al., Investigation of palladium distribution on the free air ball of Pd-coated Cu wire. In Proceedings of the 12th Electronics Packaging Technology Conference, Singapore, Dec 2010, pp. 777–782
4. T. Hisada, et al., Intermetallic growth of Cu wirebonds. In Proceedings of the 13th International Conference on Electronics Materials And Packaging (EMAP), Kyoto, Japan, 6 Dec 2011
5. S. Peng, et al., An evaluation of effects of molding compound properties on reliability of Cu wire components. In Proceedings of the 61st Electronic Components and Technology Conference (ECTC), 2011, pp. 363–369