Effect of co addition on interface reaction between Sn–Ag–Cu solder and Cu substrate
Author:
Publisher
International Association Welding
Subject
Mechanical Engineering
Reference8 articles.
1. 1. Chen, X., Zhou, J., Xue, F, Bai, J., Yao, Y. (2015) Microstructures and mechanical properties of Sn-0.1 Ag-0.7 Cu- (Co, Ni, аnd Nd) lead-free solders. J. Electron. Mater., 44, 2, 725-732.
2. 2. Nishikawa, H., Komatsu, A., Takemoto, T. (2008) Effect of Ni or Co addition to Sn-Ag solder on microstructure and joint strength at interface. Mater. Trans., 49, 7, 1518-1523.
3. Development of Sn-Ag-Cu and Sn- Ag-Cu-X alloys for Pb-free electronic solder applications, J;Anderson;Mater Sci-Mater El 18 1-3,2007
4. 4. Gao, F., Takemoto, T., Nishikawa, H. (2006) Effects of Co and Ni addition on reactive diffusion between Sn-3.5Ag solder and Cu during soldering and annealing. Mater. Sci. Eng. A., 420, 1-2, 39-46.
5. Effects of Co nanoparticle addition to Sn-3.8Ag-0.7 Cu solder on interfacial structure after reflow and ageing;Haseeb;Intermetallics 19,2011
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